Features of UV laser cutting machine

The ultraviolet cutting machine is a cutting system that uses ultraviolet lasers. It takes advantage of the strong characteristics of ultraviolet light and has higher precision and better cutting results than traditional long-wavelength cutting machines. The use of high-energy laser sources and accurate control of the laser beam can effectively increase the processing speed and obtain more accurate processing results, which is the ultraviolet laser cutting machine.

Features of UV cutting machine:

1. Ultraviolet laser, cold light source, small cutting heat affected zone;

2. The laser has the functions of FPC profile cutting, cover film opening, drilling and other functions in the flexible circuit board manufacturing process+

3. Directly use CAD data for laser cutting, which is more convenient and faster, and shortens the delivery cycle;

4. Reduce the processing difficulty due to the complex and diverse cutting shapes;

5. When opening the window of the cover film, the edge of the cut cover film outline is neat and round, smooth, without burrs, and without glue overflow, etc.;

6. Flexible board sample processing often results in changes in the cover film window due to customer needs to modify the wiring and pad positions. The traditional method requires replacement or modification of the mold. With laser processing, this problem can be solved, because you can easily and quickly process the cover film you want to open the window graphics by importing the modified CAD data, which will win the market for you in terms of time and cost. Competitive opportunities.

7. The laser processing precision is high, the laser can process the material into any shape with high precision.

8. Compared with traditional mechanical cutting, there is no need to make molds during mass production, which reduces production costs.

UV laser cutting machine is widely used in the cutting of organic and inorganic materials, especially suitable for PCB cutting and splitting, FPC cutting, cover film cutting and opening, silicon wafer cutting/scribing, ceramic cutting/scribing/drilling, glass cutting /Scribing/texturing, fingerprint recognition chip cutting, PET film cutting, PI film cutting, copper foil and other ultra-thin metal cutting, drilling, carbon fiber, graphene, polymer materials, composite material cutting, etc.